ISMAIL, SHAIFUL ANWAR, Universiti Kuala Lumpur, Malaysian Institute of Industrial Technology, Johor Bahru Phone: 07-3812400, Fax: 07-3812500, Malaysia
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International Conference on Mechanical and Manufacturing Engineering (ICME2015) - Structural Integrity and Monitoring System
A STUDY OF SOLDER JOINT STRENGTH ON COPPER SUBSTRATE UNDER THERMAL AGING
Abstract
IIES2014 is organized by the Engineering Faculty UTHM.